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| author | Miquel Raynal <miquel.raynal@bootlin.com> | 2026-09-04 20:12:52 +0200 |
|---|---|---|
| committer | Michael Walle <mwalle@kernel.org> | 2026-09-07 09:45:21 +0200 |
| commit | 4da2d59f3a6cc217399b7c106c36c2f3655106a7 (patch) | |
| tree | 7ca0b1adbe443cc752e86c0634b7f4035629f6b8 /scripts/Makefile.thinlto | |
| parent | 49c32f5b2c2ec8abfc97b8c0ea0c645568f65f8e (diff) | |
| download | linux-next-4da2d59f3a6cc217399b7c106c36c2f3655106a7.tar.gz linux-next-4da2d59f3a6cc217399b7c106c36c2f3655106a7.zip | |
mtd: spi-nor: winbond: Add support for W25Q01RV-Q/N
There is an ID collision with the chip of same density from the JV
family. Both chips are very similar in practice, it is mostly a matter
of electrical differences (mostly power consumption being lower).
As a significant difference, RV chips identify themselves as supporting
the new SFDP (rev F) field which forces an alternate write SR2
opcode (0x31).
Reviewed-by: Michael Walle <mwalle@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Signed-off-by: Michael Walle <mwalle@kernel.org>
Diffstat (limited to 'scripts/Makefile.thinlto')
0 files changed, 0 insertions, 0 deletions