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| author | Miquel Raynal <miquel.raynal@bootlin.com> | 2026-09-04 20:12:58 +0200 |
|---|---|---|
| committer | Michael Walle <mwalle@kernel.org> | 2026-09-07 09:45:22 +0200 |
| commit | 8eb8c80e59a3cde9fd7e4d730532668cb8ef7b0d (patch) | |
| tree | 7e7bfe5849c19a6ab268594019b149fada81f587 /scripts/Makefile.thinlto | |
| parent | 11484eb5458fd54b59f35c511819af9e4de27cd1 (diff) | |
| download | linux-next-8eb8c80e59a3cde9fd7e4d730532668cb8ef7b0d.tar.gz linux-next-8eb8c80e59a3cde9fd7e4d730532668cb8ef7b0d.zip | |
mtd: spi-nor: winbond: Add support for W25Q25RV-M
There is an ID collision with the chip of same density from the JV
family. Both chips are very similar in practice, it is mostly a matter
of electrical differences (mostly power consumption being lower).
As a significant difference, RV chips identify themselves as supporting
the new SFDP (rev F) field which forces an alternate write SR2
opcode (0x31).
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Signed-off-by: Michael Walle <mwalle@kernel.org>
Diffstat (limited to 'scripts/Makefile.thinlto')
0 files changed, 0 insertions, 0 deletions